World's Most Advanced Stencil Coating NanoSlic offers the world’s most advanced coating for solder paste stencils. The NanoSlic Stencil Coating System is a turn-key system that integrates surface preparation, coating and curing to provide unparalleled printing improvements, transfer efficiency and ease-of-cleaning.
NanoSlic Gold Long Life Research Project Learn about research to date on this new technology including the background of modifications, how it affects the stencil production process, performance test results including novel test methods developed specifically to measure coating longevity, and a comparison of major coatings on the market with an emphasis on longevity. BRS is the exclusive U.S. licensee of NanoSlic Gold.
The Nanoslic Coating System
NanoSlic is the industry-leading coating that provides increased transfer efficiency, improved print quality, reduced bridging, improved profile quality, and reduced cleaning. The NanoSlic Coating System provides custom-designed application equipment and ancillary supplies to help our customers apply the coating much more efficiently, leading to lasting benefits. Additionally, the NanoSlic Coating System offers global technical support and customer service. NanoSlic licensees are established in the United States, Canada, Mexico, Europe, Asia. Please contact us to inquire about licensing.
The NanoSlic Coating System implements award-winning chemistry to create the most advanced solder paste stencil available today. Building on the proven benefits of the Slic stencil, advanced chemistry is used to impart a highly Hydrophobic & Oleophobic surface to the apertures and underside of the stencil. This non-stick surface resists solder paste build-up, significantly reducing the need for cleaning cycles. The Nano coating is bonded to and conforms to aperture walls regardless of size or geometry. The NanoSlic stencil improves paste release, enabling high yield printing at low area SARs (surface area ratios). NanoSlic has a robust surface that stands up to repeated cleaning.